A3P250L-1FGG144Y vs A3P250L-1FG144I feature comparison

A3P250L-1FGG144Y Microsemi Corporation

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A3P250L-1FG144I Actel Corporation

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Rohs Code Yes No
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer MICROSEMI CORP ACTEL CORP
Package Description BGA, BGA144,12X12,40 13 X 13 MM, 1.45 MM HEIGHT, 1 MM PITCH, FBGA-144
Reach Compliance Code compliant compliant
HTS Code 8542.39.00.01
Clock Frequency-Max 250 MHz 350 MHz
JESD-30 Code S-PBGA-B144 S-PBGA-B144
JESD-609 Code e1 e0
Moisture Sensitivity Level 3 3
Number of Inputs 97 97
Number of Logic Cells 6144 6144
Number of Outputs 97 97
Number of Terminals 144 144
Operating Temperature-Max 70 °C 85 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA LBGA
Package Equivalence Code BGA144,12X12,40 BGA144,12X12,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY, LOW PROFILE
Peak Reflow Temperature (Cel) 260
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL INDUSTRIAL
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu) TIN LEAD SILVER
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30
Base Number Matches 3 2
Length 13 mm
Number of CLBs 6144
Number of Equivalent Gates 250000
Organization 6144 CLBS, 250000 GATES
Seated Height-Max 1.55 mm
Supply Voltage-Max 1.575 V
Supply Voltage-Min 1.14 V
Supply Voltage-Nom 1.2 V
Width 13 mm

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