A3P250L-PQ208Y
vs
A3P250L-1FGG144Y
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
MICROCHIP TECHNOLOGY INC
MICROSEMI CORP
Reach Compliance Code
compliant
compliant
HTS Code
8542.39.00.01
8542.39.00.01
Clock Frequency-Max
250 MHz
250 MHz
JESD-30 Code
S-PQFP-G208
S-PBGA-B144
Length
28 mm
Number of CLBs
6144
Number of Equivalent Gates
250000
Number of Inputs
151
97
Number of Logic Cells
6144
6144
Number of Outputs
151
97
Number of Terminals
208
144
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Organization
6144 CLBS, 250000 GATES
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
QFP
BGA
Package Equivalence Code
QFP208,1.2SQ,20
BGA144,12X12,40
Package Shape
SQUARE
SQUARE
Package Style
FLATPACK
GRID ARRAY
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
FIELD PROGRAMMABLE GATE ARRAY
Qualification Status
Not Qualified
Not Qualified
Supply Voltage-Max
1.575 V
Supply Voltage-Min
1.14 V
Supply Voltage-Nom
1.2 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Form
GULL WING
BALL
Terminal Pitch
0.5 mm
1 mm
Terminal Position
QUAD
BOTTOM
Width
28 mm
Base Number Matches
3
3
Package Description
BGA, BGA144,12X12,40
JESD-609 Code
e1
Moisture Sensitivity Level
3
Peak Reflow Temperature (Cel)
260
Terminal Finish
Tin/Silver/Copper (Sn/Ag/Cu)
Time@Peak Reflow Temperature-Max (s)
30
Compare A3P250L-PQ208Y with alternatives
Compare A3P250L-1FGG144Y with alternatives