A3P250L-1FGG144Y vs A3P250L-PQ208YI feature comparison

A3P250L-1FGG144Y Microsemi Corporation

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A3P250L-PQ208YI Microchip Technology Inc

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Rohs Code Yes No
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer MICROSEMI CORP MICROCHIP TECHNOLOGY INC
Package Description BGA, BGA144,12X12,40
Reach Compliance Code compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
Clock Frequency-Max 250 MHz 250 MHz
JESD-30 Code S-PBGA-B144 S-PQFP-G208
JESD-609 Code e1
Moisture Sensitivity Level 3
Number of Inputs 97 151
Number of Logic Cells 6144 6144
Number of Outputs 97 151
Number of Terminals 144 208
Operating Temperature-Max 70 °C 85 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA QFP
Package Equivalence Code BGA144,12X12,40 QFP208,1.2SQ,20
Package Shape SQUARE SQUARE
Package Style GRID ARRAY FLATPACK
Peak Reflow Temperature (Cel) 260
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL INDUSTRIAL
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form BALL GULL WING
Terminal Pitch 1 mm 0.5 mm
Terminal Position BOTTOM QUAD
Time@Peak Reflow Temperature-Max (s) 30
Base Number Matches 3 3
Length 28 mm
Number of CLBs 6144
Number of Equivalent Gates 250000
Organization 6144 CLBS, 250000 GATES
Supply Voltage-Max 1.575 V
Supply Voltage-Min 1.14 V
Supply Voltage-Nom 1.2 V
Width 28 mm

Compare A3P250L-1FGG144Y with alternatives

Compare A3P250L-PQ208YI with alternatives