A3P250L-1FGG144Y
vs
A3P250L-PQ208YI
feature comparison
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Transferred
|
Obsolete
|
| Ihs Manufacturer |
MICROSEMI CORP
|
MICROCHIP TECHNOLOGY INC
|
| Package Description |
BGA, BGA144,12X12,40
|
|
| Reach Compliance Code |
compliant
|
compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Clock Frequency-Max |
250 MHz
|
250 MHz
|
| JESD-30 Code |
S-PBGA-B144
|
S-PQFP-G208
|
| JESD-609 Code |
e1
|
|
| Moisture Sensitivity Level |
3
|
|
| Number of Inputs |
97
|
151
|
| Number of Logic Cells |
6144
|
6144
|
| Number of Outputs |
97
|
151
|
| Number of Terminals |
144
|
208
|
| Operating Temperature-Max |
70 °C
|
85 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
BGA
|
QFP
|
| Package Equivalence Code |
BGA144,12X12,40
|
QFP208,1.2SQ,20
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY
|
FLATPACK
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY
|
FIELD PROGRAMMABLE GATE ARRAY
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
COMMERCIAL
|
INDUSTRIAL
|
| Terminal Finish |
Tin/Silver/Copper (Sn/Ag/Cu)
|
|
| Terminal Form |
BALL
|
GULL WING
|
| Terminal Pitch |
1 mm
|
0.5 mm
|
| Terminal Position |
BOTTOM
|
QUAD
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Base Number Matches |
3
|
3
|
| Length |
|
28 mm
|
| Number of CLBs |
|
6144
|
| Number of Equivalent Gates |
|
250000
|
| Organization |
|
6144 CLBS, 250000 GATES
|
| Supply Voltage-Max |
|
1.575 V
|
| Supply Voltage-Min |
|
1.14 V
|
| Supply Voltage-Nom |
|
1.2 V
|
| Width |
|
28 mm
|
|
|
|
Compare A3P250L-1FGG144Y with alternatives
Compare A3P250L-PQ208YI with alternatives