A3P250L-1FGG144Y
vs
A3P250L-PQ208YI
feature comparison
All Stats
Differences Only
Rohs Code
Yes
No
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
MICROSEMI CORP
MICROCHIP TECHNOLOGY INC
Package Description
BGA, BGA144,12X12,40
Reach Compliance Code
compliant
compliant
HTS Code
8542.39.00.01
8542.39.00.01
Clock Frequency-Max
250 MHz
250 MHz
JESD-30 Code
S-PBGA-B144
S-PQFP-G208
JESD-609 Code
e1
Moisture Sensitivity Level
3
Number of Inputs
97
151
Number of Logic Cells
6144
6144
Number of Outputs
97
151
Number of Terminals
144
208
Operating Temperature-Max
70 °C
85 °C
Operating Temperature-Min
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
QFP
Package Equivalence Code
BGA144,12X12,40
QFP208,1.2SQ,20
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
FLATPACK
Peak Reflow Temperature (Cel)
260
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
FIELD PROGRAMMABLE GATE ARRAY
Qualification Status
Not Qualified
Not Qualified
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
INDUSTRIAL
Terminal Finish
Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form
BALL
GULL WING
Terminal Pitch
1 mm
0.5 mm
Terminal Position
BOTTOM
QUAD
Time@Peak Reflow Temperature-Max (s)
30
Base Number Matches
3
3
Length
28 mm
Number of CLBs
6144
Number of Equivalent Gates
250000
Organization
6144 CLBS, 250000 GATES
Supply Voltage-Max
1.575 V
Supply Voltage-Min
1.14 V
Supply Voltage-Nom
1.2 V
Width
28 mm
Compare A3P250L-1FGG144Y with alternatives
Compare A3P250L-PQ208YI with alternatives