A3P250-VQ100I
vs
A3P250-VQG100YC
feature comparison
Rohs Code |
No
|
|
Part Life Cycle Code |
Transferred
|
Transferred
|
Ihs Manufacturer |
MICROSEMI CORP
|
MICROSEMI SOC PRODUCTS GROUP
|
Package Description |
TFQFP,
|
,
|
Reach Compliance Code |
unknown
|
unknown
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Samacsys Manufacturer |
Microsemi Corporation
|
|
Clock Frequency-Max |
350 MHz
|
|
JESD-30 Code |
S-PQFP-G100
|
|
JESD-609 Code |
e0
|
|
Length |
14 mm
|
|
Moisture Sensitivity Level |
3
|
3
|
Number of CLBs |
6144
|
|
Number of Equivalent Gates |
250000
|
|
Number of Terminals |
100
|
|
Operating Temperature-Max |
100 °C
|
|
Operating Temperature-Min |
-40 °C
|
|
Organization |
6144 CLBS, 250000 GATES
|
|
Package Body Material |
PLASTIC/EPOXY
|
|
Package Code |
TFQFP
|
|
Package Shape |
SQUARE
|
|
Package Style |
FLATPACK, THIN PROFILE, FINE PITCH
|
|
Peak Reflow Temperature (Cel) |
235
|
|
Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY
|
FIELD PROGRAMMABLE GATE ARRAY
|
Qualification Status |
Not Qualified
|
|
Seated Height-Max |
1.2 mm
|
|
Supply Voltage-Max |
1.575 V
|
|
Supply Voltage-Min |
1.425 V
|
|
Supply Voltage-Nom |
1.5 V
|
|
Surface Mount |
YES
|
|
Technology |
CMOS
|
|
Temperature Grade |
INDUSTRIAL
|
|
Terminal Finish |
Tin/Lead (Sn/Pb)
|
|
Terminal Form |
GULL WING
|
|
Terminal Pitch |
0.5 mm
|
|
Terminal Position |
QUAD
|
|
Time@Peak Reflow Temperature-Max (s) |
20
|
|
Width |
14 mm
|
|
Base Number Matches |
3
|
3
|
|
|
|
Compare A3P250-VQ100I with alternatives
Compare A3P250-VQG100YC with alternatives