A3P250-FGG256YT
vs
A3P250-FG144YC
feature comparison
Rohs Code |
Yes
|
No
|
Part Life Cycle Code |
Active
|
Active
|
Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROCHIP TECHNOLOGY INC
|
Reach Compliance Code |
compliant
|
compliant
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Clock Frequency-Max |
350 MHz
|
350 MHz
|
JESD-30 Code |
S-PBGA-B256
|
S-PBGA-B144
|
JESD-609 Code |
e1
|
e0
|
Length |
17 mm
|
13 mm
|
Moisture Sensitivity Level |
3
|
3
|
Number of Equivalent Gates |
250000
|
250000
|
Number of Inputs |
157
|
97
|
Number of Logic Cells |
6144
|
6144
|
Number of Outputs |
157
|
97
|
Number of Terminals |
256
|
144
|
Operating Temperature-Max |
125 °C
|
70 °C
|
Operating Temperature-Min |
-40 °C
|
|
Organization |
250000 GATES
|
250000 GATES
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
LBGA
|
LBGA
|
Package Equivalence Code |
BGA256,16X16,40
|
BGA144,12X12,40
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY, LOW PROFILE
|
GRID ARRAY, LOW PROFILE
|
Peak Reflow Temperature (Cel) |
250
|
|
Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY
|
FIELD PROGRAMMABLE GATE ARRAY
|
Screening Level |
AEC-Q100
|
|
Seated Height-Max |
1.7 mm
|
1.55 mm
|
Supply Voltage-Max |
1.575 V
|
1.575 V
|
Supply Voltage-Min |
1.425 V
|
1.425 V
|
Supply Voltage-Nom |
1.5 V
|
1.5 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
AUTOMOTIVE
|
COMMERCIAL
|
Terminal Finish |
TIN SILVER COPPER
|
TIN LEAD SILVER
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
1 mm
|
1 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Time@Peak Reflow Temperature-Max (s) |
30
|
|
Width |
17 mm
|
13 mm
|
Base Number Matches |
1
|
1
|
|
|
|
Compare A3P250-FGG256YT with alternatives
Compare A3P250-FG144YC with alternatives