A3P250-FG144YC
vs
A3P250-FGG144I
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Active
Transferred
Ihs Manufacturer
MICROCHIP TECHNOLOGY INC
MICROSEMI CORP
Reach Compliance Code
compliant
compliant
HTS Code
8542.39.00.01
8542.39.00.01
Clock Frequency-Max
350 MHz
350 MHz
JESD-30 Code
S-PBGA-B144
S-PBGA-B144
JESD-609 Code
e0
e1
Length
13 mm
13 mm
Moisture Sensitivity Level
3
3
Number of Equivalent Gates
250000
250000
Number of Inputs
97
Number of Logic Cells
6144
Number of Outputs
97
Number of Terminals
144
144
Operating Temperature-Max
70 °C
100 °C
Operating Temperature-Min
-40 °C
Organization
250000 GATES
6144 CLBS, 250000 GATES
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LBGA
LBGA
Package Equivalence Code
BGA144,12X12,40
BGA144,12X12,40
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY, LOW PROFILE
GRID ARRAY, LOW PROFILE
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
FIELD PROGRAMMABLE GATE ARRAY
Seated Height-Max
1.55 mm
1.55 mm
Supply Voltage-Max
1.575 V
1.575 V
Supply Voltage-Min
1.425 V
1.425 V
Supply Voltage-Nom
1.5 V
1.5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
INDUSTRIAL
Terminal Finish
TIN LEAD SILVER
TIN SILVER COPPER
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Width
13 mm
13 mm
Base Number Matches
3
3
Package Description
13X 13 MM, 1.45 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-144
Samacsys Manufacturer
Microsemi Corporation
Number of CLBs
6144
Peak Reflow Temperature (Cel)
260
Qualification Status
Not Qualified
Time@Peak Reflow Temperature-Max (s)
30
Compare A3P250-FG144YC with alternatives
Compare A3P250-FGG144I with alternatives