A3P250-FGG144I vs A3P250-FG256T feature comparison

A3P250-FGG144I Microsemi Corporation

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A3P250-FG256T Microchip Technology Inc

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Rohs Code Yes No
Part Life Cycle Code Transferred Active
Ihs Manufacturer MICROSEMI CORP MICROCHIP TECHNOLOGY INC
Package Description 13X 13 MM, 1.45 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-144 1 MM PITCH, FBGA-256
Reach Compliance Code compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
Samacsys Manufacturer Microsemi Corporation
Clock Frequency-Max 350 MHz 350 MHz
JESD-30 Code S-PBGA-B144 S-PBGA-B256
JESD-609 Code e1 e0
Length 13 mm 17 mm
Moisture Sensitivity Level 3 3
Number of CLBs 6144 6144
Number of Equivalent Gates 250000 250000
Number of Terminals 144 256
Operating Temperature-Max 100 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Organization 6144 CLBS, 250000 GATES 6144 CLBS, 250000 GATES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LBGA BGA
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, LOW PROFILE GRID ARRAY
Peak Reflow Temperature (Cel) 260 225
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.55 mm 1.8 mm
Supply Voltage-Max 1.575 V 1.575 V
Supply Voltage-Min 1.425 V 1.425 V
Supply Voltage-Nom 1.5 V 1.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL AUTOMOTIVE
Terminal Finish TIN SILVER COPPER Tin/Lead (Sn/Pb)
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 20
Width 13 mm 17 mm
Base Number Matches 9 1
Number of Inputs 157
Number of Logic Cells 6144
Number of Outputs 157
Package Equivalence Code BGA256,16X16,40
Packing Method TRAY
Screening Level AEC-Q100

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