Findchips: Compare A3P250-1QNG132 vs A3P250-1QNGG132YC

A3P250-1QNG132 vs A3P250-1QNGG132YC feature comparison

Buy Now Datasheet

Buy Now Datasheet

Rohs Code	Yes
Part Life Cycle Code	Obsolete	Transferred
Ihs Manufacturer	MICROSEMI CORP	MICROSEMI CORP
Package Description	8 X 8 MM, 0.75 MM HEIGHT, 0.50 MM PITCH, GREEN, QFN-132
Reach Compliance Code	compliant	unknown
HTS Code	8542.39.00.01	8542.39.00.01
JESD-30 Code	S-XBCC-B132
Length	8 mm
Moisture Sensitivity Level	3
Number of CLBs	6144
Number of Equivalent Gates	250000
Number of Inputs	87
Number of Outputs	87
Number of Terminals	132
Operating Temperature-Max	85 °C
Operating Temperature-Min
Organization	6144 CLBS, 250000 GATES
Package Body Material	UNSPECIFIED
Package Code	HVBCC
Package Shape	SQUARE
Package Style	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
Programmable Logic Type	FIELD PROGRAMMABLE GATE ARRAY	FIELD PROGRAMMABLE GATE ARRAY
Qualification Status	Not Qualified
Seated Height-Max	0.8 mm
Supply Voltage-Max	1.575 V
Supply Voltage-Min	1.425 V
Supply Voltage-Nom	1.5 V
Surface Mount	YES
Technology	CMOS
Temperature Grade	COMMERCIAL
Terminal Form	BUTT
Terminal Pitch	0.5 mm
Terminal Position	BOTTOM
Width	8 mm
Base Number Matches	2	2
	Programmable Logic » Field Programmable Gate Arrays	Programmable Logic » Field Programmable Gate Arrays