A3P250-1QNG132 vs A3P250-1QNG132YC feature comparison

A3P250-1QNG132 Microsemi Corporation

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A3P250-1QNG132YC Microsemi FPGA & SoC

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Rohs Code Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer MICROSEMI CORP MICROSEMI SOC PRODUCTS GROUP
Package Description 8 X 8 MM, 0.75 MM HEIGHT, 0.50 MM PITCH, GREEN, QFN-132 ,
Reach Compliance Code compliant unknown
HTS Code 8542.39.00.01 8542.39.00.01
JESD-30 Code S-XBCC-B132
Length 8 mm
Moisture Sensitivity Level 3
Number of CLBs 6144
Number of Equivalent Gates 250000
Number of Inputs 87
Number of Outputs 87
Number of Terminals 132
Operating Temperature-Max 85 °C
Operating Temperature-Min
Organization 6144 CLBS, 250000 GATES
Package Body Material UNSPECIFIED
Package Code HVBCC
Package Shape SQUARE
Package Style CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified
Seated Height-Max 0.8 mm
Supply Voltage-Max 1.575 V
Supply Voltage-Min 1.425 V
Supply Voltage-Nom 1.5 V
Surface Mount YES
Technology CMOS
Temperature Grade COMMERCIAL
Terminal Form BUTT
Terminal Pitch 0.5 mm
Terminal Position BOTTOM
Width 8 mm
Base Number Matches 2 2

Compare A3P250-1QNG132 with alternatives

Compare A3P250-1QNG132YC with alternatives