A3P250-1QNG132
vs
A3P250-1QNG132YC
feature comparison
All Stats
Differences Only
Rohs Code
Yes
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
MICROSEMI CORP
MICROSEMI SOC PRODUCTS GROUP
Package Description
8 X 8 MM, 0.75 MM HEIGHT, 0.50 MM PITCH, GREEN, QFN-132
,
Reach Compliance Code
compliant
unknown
HTS Code
8542.39.00.01
8542.39.00.01
JESD-30 Code
S-XBCC-B132
Length
8 mm
Moisture Sensitivity Level
3
Number of CLBs
6144
Number of Equivalent Gates
250000
Number of Inputs
87
Number of Outputs
87
Number of Terminals
132
Operating Temperature-Max
85 °C
Operating Temperature-Min
Organization
6144 CLBS, 250000 GATES
Package Body Material
UNSPECIFIED
Package Code
HVBCC
Package Shape
SQUARE
Package Style
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
FIELD PROGRAMMABLE GATE ARRAY
Qualification Status
Not Qualified
Seated Height-Max
0.8 mm
Supply Voltage-Max
1.575 V
Supply Voltage-Min
1.425 V
Supply Voltage-Nom
1.5 V
Surface Mount
YES
Technology
CMOS
Temperature Grade
COMMERCIAL
Terminal Form
BUTT
Terminal Pitch
0.5 mm
Terminal Position
BOTTOM
Width
8 mm
Base Number Matches
2
2
Compare A3P250-1QNG132 with alternatives
Compare A3P250-1QNG132YC with alternatives