A3P125-PQ208I vs A3P125-PQ208Y feature comparison

A3P125-PQ208I Microchip Technology Inc

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A3P125-PQ208Y Microsemi Corporation

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Rohs Code No No
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer MICROCHIP TECHNOLOGY INC MICROSEMI CORP
Reach Compliance Code unknown unknown
Clock Frequency-Max 350 MHz
JESD-30 Code S-PQFP-G208 S-PQFP-G208
JESD-609 Code e0
Length 28 mm 28 mm
Number of CLBs 3072 3072
Number of Equivalent Gates 125000 125000
Number of Inputs 133
Number of Outputs 133
Number of Terminals 208 208
Operating Temperature-Max 100 °C 85 °C
Operating Temperature-Min -40 °C
Organization 3072 CLBS, 125000 GATES 3072 CLBS, 125000 GATES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code FQFP FQFP
Package Shape SQUARE SQUARE
Package Style FLATPACK, FINE PITCH FLATPACK, FINE PITCH
Peak Reflow Temperature (Cel) NOT SPECIFIED
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified
Seated Height-Max 4.1 mm 4.1 mm
Supply Voltage-Max 1.575 V 1.575 V
Supply Voltage-Min 1.425 V 1.425 V
Supply Voltage-Nom 1.5 V 1.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL COMMERCIAL
Terminal Finish Tin/Lead (Sn/Pb)
Terminal Form GULL WING GULL WING
Terminal Pitch 0.5 mm 0.5 mm
Terminal Position QUAD QUAD
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 28 mm 28 mm
Base Number Matches 3 3
Package Description FQFP,
HTS Code 8542.39.00.01

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