A3P125-PQ208Y
vs
A3P125-PQG208Y
feature comparison
All Stats
Differences Only
Rohs Code
No
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
MICROSEMI CORP
MICROSEMI SOC PRODUCTS GROUP
Package Description
FQFP,
FQFP,
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
8542.39.00.01
JESD-30 Code
S-PQFP-G208
S-PQFP-G208
Length
28 mm
28 mm
Number of CLBs
3072
3072
Number of Equivalent Gates
125000
125000
Number of Terminals
208
208
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
Organization
3072 CLBS, 125000 GATES
3072 CLBS, 125000 GATES
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
FQFP
FQFP
Package Shape
SQUARE
SQUARE
Package Style
FLATPACK, FINE PITCH
FLATPACK, FINE PITCH
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
FIELD PROGRAMMABLE GATE ARRAY
Seated Height-Max
4.1 mm
4.1 mm
Supply Voltage-Max
1.575 V
1.575 V
Supply Voltage-Min
1.425 V
1.425 V
Supply Voltage-Nom
1.5 V
1.5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.5 mm
0.5 mm
Terminal Position
QUAD
QUAD
Width
28 mm
28 mm
Base Number Matches
3
3
Part Package Code
QFP
Pin Count
208
Moisture Sensitivity Level
3
Peak Reflow Temperature (Cel)
245
Time@Peak Reflow Temperature-Max (s)
30
Compare A3P125-PQ208Y with alternatives
Compare A3P125-PQG208Y with alternatives