A3P125-PQ208I
vs
A3P125-FGG144II
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
MICROCHIP TECHNOLOGY INC
MICROSEMI CORP
Reach Compliance Code
unknown
compliant
Clock Frequency-Max
350 MHz
350 MHz
JESD-30 Code
S-PQFP-G208
S-PBGA-B144
JESD-609 Code
e0
Length
28 mm
13 mm
Number of CLBs
3072
3072
Number of Equivalent Gates
125000
125000
Number of Inputs
133
Number of Outputs
133
Number of Terminals
208
144
Operating Temperature-Max
100 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Organization
3072 CLBS, 125000 GATES
3072 CLBS, 125000 GATES
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
FQFP
LBGA
Package Shape
SQUARE
SQUARE
Package Style
FLATPACK, FINE PITCH
GRID ARRAY, LOW PROFILE
Peak Reflow Temperature (Cel)
NOT SPECIFIED
260
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
FIELD PROGRAMMABLE GATE ARRAY
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
4.1 mm
1.55 mm
Supply Voltage-Max
1.575 V
1.575 V
Supply Voltage-Min
1.425 V
1.425 V
Supply Voltage-Nom
1.5 V
1.5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
Tin/Lead (Sn/Pb)
Terminal Form
GULL WING
BALL
Terminal Pitch
0.5 mm
1 mm
Terminal Position
QUAD
BOTTOM
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
30
Width
28 mm
13 mm
Base Number Matches
3
3
Package Description
LBGA,
HTS Code
8542.39.00.01
Moisture Sensitivity Level
3
Package Equivalence Code
BGA144,12X12,40
Compare A3P125-PQ208I with alternatives
Compare A3P125-FGG144II with alternatives