A3P125-2FGG144II
vs
A3P125-2FG144YI
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
MICROSEMI CORP
MICROSEMI CORP
Package Description
LBGA,
LBGA,
Reach Compliance Code
compliant
compliant
HTS Code
8542.39.00.01
8542.39.00.01
Clock Frequency-Max
350 MHz
JESD-30 Code
S-PBGA-B144
S-PBGA-B144
Length
13 mm
13 mm
Moisture Sensitivity Level
3
3
Number of CLBs
3072
3072
Number of Equivalent Gates
125000
125000
Number of Terminals
144
144
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Organization
3072 CLBS, 125000 GATES
3072 CLBS, 125000 GATES
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LBGA
LBGA
Package Equivalence Code
BGA144,12X12,40
BGA144,12X12,40
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY, LOW PROFILE
GRID ARRAY, LOW PROFILE
Peak Reflow Temperature (Cel)
260
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
FIELD PROGRAMMABLE GATE ARRAY
Qualification Status
Not Qualified
Seated Height-Max
1.55 mm
1.55 mm
Supply Voltage-Max
1.575 V
1.575 V
Supply Voltage-Min
1.425 V
1.425 V
Supply Voltage-Nom
1.5 V
1.5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
30
Width
13 mm
13 mm
Base Number Matches
3
3
JESD-609 Code
e0
Terminal Finish
TIN LEAD
Compare A3P125-2FGG144II with alternatives
Compare A3P125-2FG144YI with alternatives