A3P125-1FGG144II
vs
A3P125-1FG144YC
feature comparison
Rohs Code |
Yes
|
No
|
Part Life Cycle Code |
Active
|
Transferred
|
Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROSEMI CORP
|
Package Description |
13X 13 MM, 1.45 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-144
|
,
|
Reach Compliance Code |
compliant
|
compliant
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Clock Frequency-Max |
350 MHz
|
|
JESD-30 Code |
S-PBGA-B144
|
|
Length |
13 mm
|
|
Moisture Sensitivity Level |
3
|
3
|
Number of CLBs |
3072
|
|
Number of Equivalent Gates |
125000
|
|
Number of Inputs |
97
|
|
Number of Outputs |
97
|
|
Number of Terminals |
144
|
|
Operating Temperature-Max |
85 °C
|
|
Operating Temperature-Min |
-40 °C
|
|
Organization |
3072 CLBS, 125000 GATES
|
|
Package Body Material |
PLASTIC/EPOXY
|
|
Package Code |
LBGA
|
|
Package Equivalence Code |
BGA144,12X12,40
|
|
Package Shape |
SQUARE
|
|
Package Style |
GRID ARRAY, LOW PROFILE
|
|
Peak Reflow Temperature (Cel) |
260
|
|
Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY
|
FIELD PROGRAMMABLE GATE ARRAY
|
Qualification Status |
Not Qualified
|
|
Seated Height-Max |
1.55 mm
|
|
Supply Voltage-Max |
1.575 V
|
|
Supply Voltage-Min |
1.425 V
|
|
Supply Voltage-Nom |
1.5 V
|
|
Surface Mount |
YES
|
|
Technology |
CMOS
|
|
Temperature Grade |
INDUSTRIAL
|
|
Terminal Form |
BALL
|
|
Terminal Pitch |
1 mm
|
|
Terminal Position |
BOTTOM
|
|
Time@Peak Reflow Temperature-Max (s) |
30
|
|
Width |
13 mm
|
|
Base Number Matches |
1
|
1
|
JESD-609 Code |
|
e0
|
Terminal Finish |
|
TIN LEAD
|
|
|
|
Compare A3P125-1FGG144II with alternatives
Compare A3P125-1FG144YC with alternatives