A3P1000L-1FG256YI
vs
A3P600L-FGG484
feature comparison
| Rohs Code |
No
|
Yes
|
| Part Life Cycle Code |
Transferred
|
Active
|
| Ihs Manufacturer |
MICROSEMI CORP
|
MICROCHIP TECHNOLOGY INC
|
| Package Description |
BGA, BGA256,16X16,40
|
23 X 23 MM, 2.23 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-484
|
| Reach Compliance Code |
unknown
|
compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Clock Frequency-Max |
250 MHz
|
350 MHz
|
| JESD-30 Code |
S-PBGA-B256
|
S-PBGA-B484
|
| JESD-609 Code |
e0
|
e1
|
| Moisture Sensitivity Level |
3
|
3
|
| Number of Inputs |
177
|
235
|
| Number of Logic Cells |
24576
|
13824
|
| Number of Outputs |
177
|
235
|
| Number of Terminals |
256
|
484
|
| Operating Temperature-Max |
85 °C
|
70 °C
|
| Operating Temperature-Min |
-40 °C
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
BGA
|
BGA
|
| Package Equivalence Code |
BGA256,16X16,40
|
BGA484,22X22,40
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY
|
GRID ARRAY
|
| Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY
|
FIELD PROGRAMMABLE GATE ARRAY
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
COMMERCIAL
|
| Terminal Finish |
TIN LEAD SILVER
|
TIN SILVER COPPER
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
1 mm
|
1 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Base Number Matches |
3
|
3
|
| Factory Lead Time |
|
8 Weeks
|
| Length |
|
23 mm
|
| Number of CLBs |
|
13824
|
| Number of Equivalent Gates |
|
600000
|
| Organization |
|
13824 CLBS, 600000 GATES
|
| Peak Reflow Temperature (Cel) |
|
250
|
| Seated Height-Max |
|
2.44 mm
|
| Supply Voltage-Max |
|
1.575 V
|
| Supply Voltage-Min |
|
1.14 V
|
| Supply Voltage-Nom |
|
1.2 V
|
| Time@Peak Reflow Temperature-Max (s) |
|
30
|
| Width |
|
23 mm
|
|
|
|
Compare A3P1000L-1FG256YI with alternatives
Compare A3P600L-FGG484 with alternatives