A3P1000L-1FG256YI
vs
A3P600L-FG256YI
feature comparison
Part Life Cycle Code |
Transferred
|
Transferred
|
Ihs Manufacturer |
MICROSEMI SOC PRODUCTS GROUP
|
MICROSEMI SOC PRODUCTS GROUP
|
Package Description |
BGA, BGA256,16X16,40
|
BGA, BGA256,16X16,40
|
Reach Compliance Code |
unknown
|
unknown
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Clock Frequency-Max |
250 MHz
|
250 MHz
|
JESD-30 Code |
S-PBGA-B256
|
S-PBGA-B256
|
JESD-609 Code |
e0
|
e0
|
Moisture Sensitivity Level |
3
|
3
|
Number of Inputs |
177
|
177
|
Number of Logic Cells |
24576
|
13824
|
Number of Outputs |
177
|
177
|
Number of Terminals |
256
|
256
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
BGA
|
BGA
|
Package Equivalence Code |
BGA256,16X16,40
|
BGA256,16X16,40
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY
|
GRID ARRAY
|
Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY
|
FIELD PROGRAMMABLE GATE ARRAY
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Finish |
TIN LEAD SILVER
|
TIN LEAD
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
1 mm
|
1 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Base Number Matches |
3
|
3
|
|
|
|
Compare A3P1000L-1FG256YI with alternatives
Compare A3P600L-FG256YI with alternatives