A3P1000L-1FG256 vs A3P1000L-1FG256YI feature comparison

A3P1000L-1FG256 Microsemi Corporation

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A3P1000L-1FG256YI Microchip Technology Inc

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Rohs Code No No
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer MICROSEMI CORP MICROCHIP TECHNOLOGY INC
Package Description BGA, BGA256,16X16,40
Reach Compliance Code unknown compliant
HTS Code 8542.39.00.01 8542.39.00.01
Clock Frequency-Max 350 MHz 250 MHz
JESD-30 Code S-PBGA-B256 S-PBGA-B256
Length 17 mm
Moisture Sensitivity Level 3 3
Number of CLBs 24576
Number of Equivalent Gates 1000000
Number of Inputs 177 177
Number of Logic Cells 24576 24576
Number of Outputs 177 177
Number of Terminals 256 256
Operating Temperature-Max 70 °C 85 °C
Operating Temperature-Min -40 °C
Organization 24576 CLBS, 1000000 GATES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA256,16X16,40 BGA256,16X16,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.8 mm
Supply Voltage-Max 1.575 V
Supply Voltage-Min 1.14 V
Supply Voltage-Nom 1.2 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL INDUSTRIAL
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Width 17 mm
Base Number Matches 3 3
JESD-609 Code e0
Terminal Finish TIN LEAD SILVER

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Compare A3P1000L-1FG256YI with alternatives