Findchips: Compare A3P1000L-1FG256 vs A3P1000L-1FGG256I

A3P1000L-1FG256 vs A3P1000L-1FGG256I feature comparison

Buy Now Datasheet

Buy Now Datasheet

Rohs Code	No	Yes
Part Life Cycle Code	Transferred	Transferred
Ihs Manufacturer	ACTEL CORP	MICROSEMI CORP
Package Description	17 X 17 MM, 1.60 MM HEIGHT, 1 MM PITCH, FBGA-256	BGA, BGA256,16X16,40
Reach Compliance Code	compliant	compliant
Clock Frequency-Max	350 MHz	350 MHz
JESD-30 Code	S-PBGA-B256	S-PBGA-B256
Length	17 mm	17 mm
Moisture Sensitivity Level	3	3
Number of CLBs	24576	24576
Number of Equivalent Gates	1000000	1000000
Number of Inputs	177	177
Number of Logic Cells	24576	24576
Number of Outputs	177	177
Number of Terminals	256	256
Operating Temperature-Max	70 °C	85 °C
Operating Temperature-Min		-40 °C
Organization	24576 CLBS, 1000000 GATES	24576 CLBS, 1000000 GATES
Package Body Material	PLASTIC/EPOXY	PLASTIC/EPOXY
Package Code	BGA	BGA
Package Equivalence Code	BGA256,16X16,40	BGA256,16X16,40
Package Shape	SQUARE	SQUARE
Package Style	GRID ARRAY	GRID ARRAY
Programmable Logic Type	FIELD PROGRAMMABLE GATE ARRAY	FIELD PROGRAMMABLE GATE ARRAY
Qualification Status	Not Qualified	Not Qualified
Seated Height-Max	1.8 mm	1.8 mm
Supply Voltage-Max	1.575 V	1.575 V
Supply Voltage-Min	1.14 V	1.14 V
Supply Voltage-Nom	1.2 V	1.2 V
Surface Mount	YES	YES
Technology	CMOS	CMOS
Temperature Grade	COMMERCIAL	INDUSTRIAL
Terminal Form	BALL	BALL
Terminal Pitch	1 mm	1 mm
Terminal Position	BOTTOM	BOTTOM
Width	17 mm	17 mm
Base Number Matches	3	3
HTS Code		8542.39.00.01
JESD-609 Code		e1
Peak Reflow Temperature (Cel)		250
Terminal Finish		Tin/Silver/Copper (Sn/Ag/Cu)
Time@Peak Reflow Temperature-Max (s)		30
	Programmable Logic » Field Programmable Gate Arrays	Programmable Logic » Field Programmable Gate Arrays