A3P1000-2FGG484YI vs A3P1000-2FGG484Y feature comparison

A3P1000-2FGG484YI Microsemi Corporation

Buy Now Datasheet

A3P1000-2FGG484Y Microsemi Corporation

Buy Now Datasheet
Rohs Code Yes Yes
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer MICROSEMI CORP MICROSEMI CORP
Package Description BGA, BGA,
Reach Compliance Code compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
JESD-30 Code S-PBGA-B484 S-PBGA-B484
JESD-609 Code e1 e1
Length 23 mm 23 mm
Moisture Sensitivity Level 3 3
Number of CLBs 24576 24576
Number of Equivalent Gates 1000000 1000000
Number of Terminals 484 484
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C
Organization 24576 CLBS, 1000000 GATES 24576 CLBS, 1000000 GATES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Peak Reflow Temperature (Cel) 250 250
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Seated Height-Max 2.44 mm 2.44 mm
Supply Voltage-Max 1.575 V 1.575 V
Supply Voltage-Min 1.425 V 1.425 V
Supply Voltage-Nom 1.5 V 1.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL COMMERCIAL
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu) Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 30
Width 23 mm 23 mm
Base Number Matches 3 3

Compare A3P1000-2FGG484YI with alternatives

Compare A3P1000-2FGG484Y with alternatives