A3P1000-2FGG484YI
vs
A3P1000-2FGG484Y
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
MICROSEMI CORP
MICROSEMI CORP
Package Description
BGA,
BGA,
Reach Compliance Code
compliant
compliant
HTS Code
8542.39.00.01
8542.39.00.01
JESD-30 Code
S-PBGA-B484
S-PBGA-B484
JESD-609 Code
e1
e1
Length
23 mm
23 mm
Moisture Sensitivity Level
3
3
Number of CLBs
24576
24576
Number of Equivalent Gates
1000000
1000000
Number of Terminals
484
484
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
Organization
24576 CLBS, 1000000 GATES
24576 CLBS, 1000000 GATES
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
BGA
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Peak Reflow Temperature (Cel)
250
250
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
FIELD PROGRAMMABLE GATE ARRAY
Seated Height-Max
2.44 mm
2.44 mm
Supply Voltage-Max
1.575 V
1.575 V
Supply Voltage-Min
1.425 V
1.425 V
Supply Voltage-Nom
1.5 V
1.5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
COMMERCIAL
Terminal Finish
Tin/Silver/Copper (Sn/Ag/Cu)
Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
30
30
Width
23 mm
23 mm
Base Number Matches
3
3
Compare A3P1000-2FGG484YI with alternatives
Compare A3P1000-2FGG484Y with alternatives