A3P1000-2FGG484YI vs A3P1000-2FG484YI feature comparison

A3P1000-2FGG484YI Microsemi FPGA & SoC

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A3P1000-2FG484YI Microsemi Corporation

Buy Now Datasheet
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer MICROSEMI SOC PRODUCTS GROUP MICROSEMI CORP
Part Package Code BGA
Package Description BGA, BGA,
Pin Count 484
Reach Compliance Code unknown compliant
HTS Code 8542.39.00.01 8542.39.00.01
JESD-30 Code S-PBGA-B484 S-PBGA-B484
JESD-609 Code e1 e0
Length 23 mm 23 mm
Moisture Sensitivity Level 3 3
Number of CLBs 24576 24576
Number of Equivalent Gates 1000000 1000000
Number of Terminals 484 484
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Organization 24576 CLBS, 1000000 GATES 24576 CLBS, 1000000 GATES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Peak Reflow Temperature (Cel) 250
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Seated Height-Max 2.44 mm 2.44 mm
Supply Voltage-Max 1.575 V 1.575 V
Supply Voltage-Min 1.425 V 1.425 V
Supply Voltage-Nom 1.5 V 1.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu) TIN LEAD
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30
Width 23 mm 23 mm
Base Number Matches 3 3
Rohs Code Yes

Compare A3P1000-2FGG484YI with alternatives

Compare A3P1000-2FG484YI with alternatives