A3P1000-1PQ208YM
vs
A3P1000-2FGG144IY
feature comparison
Part Life Cycle Code |
Transferred
|
Active
|
Ihs Manufacturer |
MICROSEMI CORP
|
MICROCHIP TECHNOLOGY INC
|
Package Description |
FQFP,
|
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
3A001.A.2.C
|
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
JESD-30 Code |
S-PQFP-G208
|
|
Length |
28 mm
|
|
Number of CLBs |
24576
|
|
Number of Equivalent Gates |
1000000
|
|
Number of Terminals |
208
|
|
Operating Temperature-Max |
125 °C
|
|
Operating Temperature-Min |
-55 °C
|
|
Organization |
24576 CLBS, 1000000 GATES
|
|
Package Body Material |
PLASTIC/EPOXY
|
|
Package Code |
FQFP
|
|
Package Shape |
SQUARE
|
|
Package Style |
FLATPACK, FINE PITCH
|
|
Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY
|
FIELD PROGRAMMABLE GATE ARRAY
|
Seated Height-Max |
4.1 mm
|
|
Supply Voltage-Max |
1.575 V
|
|
Supply Voltage-Min |
1.14 V
|
|
Supply Voltage-Nom |
1.2 V
|
|
Surface Mount |
YES
|
|
Technology |
CMOS
|
|
Temperature Grade |
MILITARY
|
|
Terminal Form |
GULL WING
|
|
Terminal Pitch |
0.5 mm
|
|
Terminal Position |
QUAD
|
|
Width |
28 mm
|
|
Base Number Matches |
2
|
2
|
Rohs Code |
|
Yes
|
Moisture Sensitivity Level |
|
3
|
Peak Reflow Temperature (Cel) |
|
260
|
Time@Peak Reflow Temperature-Max (s) |
|
30
|
|
|
|
Compare A3P1000-1PQ208YM with alternatives
Compare A3P1000-2FGG144IY with alternatives