A3P1000-2FGG144IY
vs
A3P1000-2FGG144II
feature comparison
Rohs Code |
Yes
|
|
Part Life Cycle Code |
Active
|
Transferred
|
Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
ACTEL CORP
|
Reach Compliance Code |
compliant
|
unknown
|
HTS Code |
8542.39.00.01
|
|
Moisture Sensitivity Level |
3
|
|
Peak Reflow Temperature (Cel) |
260
|
|
Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY
|
FIELD PROGRAMMABLE GATE ARRAY
|
Time@Peak Reflow Temperature-Max (s) |
30
|
|
Base Number Matches |
2
|
3
|
Package Description |
|
13X 13 MM, 1.45 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-144
|
Clock Frequency-Max |
|
350 MHz
|
JESD-30 Code |
|
S-PBGA-B144
|
Length |
|
13 mm
|
Number of CLBs |
|
24576
|
Number of Equivalent Gates |
|
1000000
|
Number of Terminals |
|
144
|
Operating Temperature-Max |
|
85 °C
|
Operating Temperature-Min |
|
-40 °C
|
Organization |
|
24576 CLBS, 1000000 GATES
|
Package Body Material |
|
PLASTIC/EPOXY
|
Package Code |
|
LBGA
|
Package Equivalence Code |
|
BGA144,12X12,40
|
Package Shape |
|
SQUARE
|
Package Style |
|
GRID ARRAY, LOW PROFILE
|
Qualification Status |
|
Not Qualified
|
Seated Height-Max |
|
1.55 mm
|
Supply Voltage-Max |
|
1.575 V
|
Supply Voltage-Min |
|
1.425 V
|
Supply Voltage-Nom |
|
1.5 V
|
Surface Mount |
|
YES
|
Technology |
|
CMOS
|
Temperature Grade |
|
INDUSTRIAL
|
Terminal Form |
|
BALL
|
Terminal Pitch |
|
1 mm
|
Terminal Position |
|
BOTTOM
|
Width |
|
13 mm
|
|
|
|
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