A3P1000-1PQ208M vs A3P1000-1FGG484II feature comparison

A3P1000-1PQ208M Microchip Technology Inc

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A3P1000-1FGG484II Microsemi Corporation

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Rohs Code No Yes
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer MICROCHIP TECHNOLOGY INC MICROSEMI CORP
Package Description 0.50 MM PITCH, PLASTIC, QFP-208 BGA,
Reach Compliance Code compliant compliant
Samacsys Manufacturer Microchip
Clock Frequency-Max 350 MHz 350 MHz
JESD-30 Code S-PQFP-G208 S-PBGA-B484
JESD-609 Code e0
Length 28 mm 23 mm
Moisture Sensitivity Level 3 3
Number of CLBs 24576 24576
Number of Equivalent Gates 1000000 1000000
Number of Inputs 154
Number of Logic Cells 24576
Number of Outputs 154
Number of Terminals 208 484
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -55 °C -40 °C
Organization 24576 CLBS, 1000000 GATES 24576 CLBS, 1000000 GATES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code FQFP BGA
Package Equivalence Code QFP208,1.2SQ,20
Package Shape SQUARE SQUARE
Package Style FLATPACK, FINE PITCH GRID ARRAY
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 4.1 mm 2.44 mm
Supply Voltage-Max 1.575 V 1.575 V
Supply Voltage-Min 1.425 V 1.425 V
Supply Voltage-Nom 1.5 V 1.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade MILITARY INDUSTRIAL
Terminal Finish TIN LEAD
Terminal Form GULL WING BALL
Terminal Pitch 0.5 mm 1 mm
Terminal Position QUAD BOTTOM
Width 28 mm 23 mm
Base Number Matches 1 3
HTS Code 8542.39.00.01
Peak Reflow Temperature (Cel) 250
Time@Peak Reflow Temperature-Max (s) 30

Compare A3P1000-1PQ208M with alternatives

Compare A3P1000-1FGG484II with alternatives