Findchips: Compare A3P1000-1FGG484Y vs A3P1000-1FG484I

A3P1000-1FGG484Y vs A3P1000-1FG484I feature comparison

Buy Now Datasheet

Buy Now Datasheet

Part Life Cycle Code	Transferred	Active
Ihs Manufacturer	MICROSEMI SOC PRODUCTS GROUP	MICROCHIP TECHNOLOGY INC
Part Package Code	BGA
Package Description	BGA,	23 X 23 MM, 2.23 MM HEIGHT, 1 MM PITCH, FBGA-484
Pin Count	484
Reach Compliance Code	unknown	compliant
HTS Code	8542.39.00.01	8542.39.00.01
JESD-30 Code	S-PBGA-B484	S-PBGA-B484
JESD-609 Code	e1	e0
Length	23 mm	23 mm
Moisture Sensitivity Level	3
Number of CLBs	24576	24576
Number of Equivalent Gates	1000000	1000000
Number of Terminals	484	484
Operating Temperature-Max	85 °C	100 °C
Operating Temperature-Min		-40 °C
Organization	24576 CLBS, 1000000 GATES	24576 CLBS, 1000000 GATES
Package Body Material	PLASTIC/EPOXY	PLASTIC/EPOXY
Package Code	BGA	BGA
Package Shape	SQUARE	SQUARE
Package Style	GRID ARRAY	GRID ARRAY
Peak Reflow Temperature (Cel)	250
Programmable Logic Type	FIELD PROGRAMMABLE GATE ARRAY	FIELD PROGRAMMABLE GATE ARRAY
Seated Height-Max	2.44 mm	2.44 mm
Supply Voltage-Max	1.575 V	1.575 V
Supply Voltage-Min	1.425 V	1.425 V
Supply Voltage-Nom	1.5 V	1.5 V
Surface Mount	YES	YES
Technology	CMOS	CMOS
Temperature Grade	COMMERCIAL	INDUSTRIAL
Terminal Finish	Tin/Silver/Copper (Sn/Ag/Cu)	TIN LEAD
Terminal Form	BALL	BALL
Terminal Pitch	1 mm	1 mm
Terminal Position	BOTTOM	BOTTOM
Time@Peak Reflow Temperature-Max (s)	30
Width	23 mm	23 mm
Base Number Matches	6	8
Rohs Code		No
Samacsys Manufacturer		Microchip
Clock Frequency-Max		350 MHz
Number of Inputs		300
Number of Outputs		300
Packing Method		TRAY
Qualification Status		Not Qualified
	Programmable Logic » Field Programmable Gate Arrays	Programmable Logic » Field Programmable Gate Arrays