A3P1000-1FG484I
vs
A3P1000-1FGG484YT
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Active
Transferred
Ihs Manufacturer
MICROCHIP TECHNOLOGY INC
MICROSEMI SOC PRODUCTS GROUP
Package Description
23 X 23 MM, 2.23 MM HEIGHT, 1 MM PITCH, FBGA-484
,
Reach Compliance Code
compliant
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Samacsys Manufacturer
Microchip
Clock Frequency-Max
350 MHz
JESD-30 Code
S-PBGA-B484
JESD-609 Code
e0
e1
Length
23 mm
Number of CLBs
24576
Number of Equivalent Gates
1000000
Number of Inputs
300
Number of Outputs
300
Number of Terminals
484
Operating Temperature-Max
100 °C
Operating Temperature-Min
-40 °C
Organization
24576 CLBS, 1000000 GATES
Package Body Material
PLASTIC/EPOXY
Package Code
BGA
Package Shape
SQUARE
Package Style
GRID ARRAY
Packing Method
TRAY
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
FIELD PROGRAMMABLE GATE ARRAY
Qualification Status
Not Qualified
Seated Height-Max
2.44 mm
Supply Voltage-Max
1.575 V
Supply Voltage-Min
1.425 V
Supply Voltage-Nom
1.5 V
Surface Mount
YES
Technology
CMOS
Temperature Grade
INDUSTRIAL
Terminal Finish
TIN LEAD
Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form
BALL
Terminal Pitch
1 mm
Terminal Position
BOTTOM
Width
23 mm
Base Number Matches
3
3
Moisture Sensitivity Level
3
Peak Reflow Temperature (Cel)
250
Time@Peak Reflow Temperature-Max (s)
30
Compare A3P1000-1FG484I with alternatives
Compare A3P1000-1FGG484YT with alternatives