A3P1000-1FG484YC vs A3P1000-FG144I feature comparison

A3P1000-1FG484YC Microchip Technology Inc

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A3P1000-FG144I Microchip Technology Inc

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Rohs Code No No
Part Life Cycle Code Active Active
Ihs Manufacturer MICROCHIP TECHNOLOGY INC MICROCHIP TECHNOLOGY INC
Reach Compliance Code compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
Clock Frequency-Max 350 MHz 350 MHz
JESD-30 Code S-PBGA-B484 S-PBGA-B144
JESD-609 Code e0 e0
Length 27 mm 13 mm
Moisture Sensitivity Level 3 3
Number of Equivalent Gates 1000000 1000000
Number of Inputs 300 97
Number of Logic Cells 24576
Number of Outputs 300 97
Number of Terminals 484 144
Operating Temperature-Max 70 °C 100 °C
Operating Temperature-Min -40 °C
Organization 1000000 GATES 24576 CLBS, 1000000 GATES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA LBGA
Package Equivalence Code BGA484,22X22,40 BGA144,12X12,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY, LOW PROFILE
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Seated Height-Max 2.44 mm 1.55 mm
Supply Voltage-Max 1.575 V 1.575 V
Supply Voltage-Min 1.425 V 1.425 V
Supply Voltage-Nom 1.5 V 1.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL INDUSTRIAL
Terminal Finish TIN LEAD TIN LEAD
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Width 27 mm 13 mm
Base Number Matches 1 8
Package Description 13X 13 MM, 1.45 MM HEIGHT, 1 MM PITCH, FBGA-144
Factory Lead Time 4 Weeks
Samacsys Manufacturer Microchip
Number of CLBs 24576
Packing Method TRAY
Peak Reflow Temperature (Cel) 235
Qualification Status Not Qualified
Time@Peak Reflow Temperature-Max (s) 20

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