A3P1000-1FG484YC
vs
A3P1000-1FGG484I
feature comparison
All Stats
Differences Only
Rohs Code
No
Yes
Part Life Cycle Code
Active
Transferred
Ihs Manufacturer
MICROCHIP TECHNOLOGY INC
MICROSEMI CORP
Reach Compliance Code
compliant
compliant
HTS Code
8542.39.00.01
8542.39.00.01
Clock Frequency-Max
350 MHz
350 MHz
JESD-30 Code
S-PBGA-B484
S-PBGA-B484
JESD-609 Code
e0
e1
Length
27 mm
23 mm
Moisture Sensitivity Level
3
3
Number of Equivalent Gates
1000000
1000000
Number of Inputs
300
Number of Logic Cells
24576
Number of Outputs
300
Number of Terminals
484
484
Operating Temperature-Max
70 °C
100 °C
Operating Temperature-Min
-40 °C
Organization
1000000 GATES
24576 CLBS, 1000000 GATES
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
BGA
Package Equivalence Code
BGA484,22X22,40
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
FIELD PROGRAMMABLE GATE ARRAY
Seated Height-Max
2.44 mm
2.44 mm
Supply Voltage-Max
1.575 V
1.575 V
Supply Voltage-Min
1.425 V
1.425 V
Supply Voltage-Nom
1.5 V
1.5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
INDUSTRIAL
Terminal Finish
TIN LEAD
TIN SILVER COPPER
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Width
27 mm
23 mm
Base Number Matches
1
11
Package Description
BGA,
Number of CLBs
24576
Peak Reflow Temperature (Cel)
250
Qualification Status
Not Qualified
Time@Peak Reflow Temperature-Max (s)
30
Compare A3P1000-1FG484YC with alternatives
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