A3P1000-1FG484YC vs A3P1000-1FGG484I feature comparison

A3P1000-1FG484YC Microchip Technology Inc

Buy Now Datasheet

A3P1000-1FGG484I Microsemi Corporation

Buy Now Datasheet
Rohs Code No Yes
Part Life Cycle Code Active Transferred
Ihs Manufacturer MICROCHIP TECHNOLOGY INC MICROSEMI CORP
Reach Compliance Code compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
Clock Frequency-Max 350 MHz 350 MHz
JESD-30 Code S-PBGA-B484 S-PBGA-B484
JESD-609 Code e0 e1
Length 27 mm 23 mm
Moisture Sensitivity Level 3 3
Number of Equivalent Gates 1000000 1000000
Number of Inputs 300
Number of Logic Cells 24576
Number of Outputs 300
Number of Terminals 484 484
Operating Temperature-Max 70 °C 100 °C
Operating Temperature-Min -40 °C
Organization 1000000 GATES 24576 CLBS, 1000000 GATES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA484,22X22,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Seated Height-Max 2.44 mm 2.44 mm
Supply Voltage-Max 1.575 V 1.575 V
Supply Voltage-Min 1.425 V 1.425 V
Supply Voltage-Nom 1.5 V 1.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL INDUSTRIAL
Terminal Finish TIN LEAD TIN SILVER COPPER
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Width 27 mm 23 mm
Base Number Matches 1 11
Package Description BGA,
Number of CLBs 24576
Peak Reflow Temperature (Cel) 250
Qualification Status Not Qualified
Time@Peak Reflow Temperature-Max (s) 30

Compare A3P1000-1FG484YC with alternatives

Compare A3P1000-1FGG484I with alternatives