A3P1000-1FGG484I
vs
A3P1000-1FG484C
feature comparison
All Stats
Differences Only
Rohs Code
Yes
No
Part Life Cycle Code
Transferred
Active
Ihs Manufacturer
MICROSEMI CORP
MICROCHIP TECHNOLOGY INC
Package Description
BGA,
1 MM PITCH, FBGA-484
Reach Compliance Code
compliant
compliant
HTS Code
8542.39.00.01
8542.39.00.01
Clock Frequency-Max
350 MHz
350 MHz
JESD-30 Code
S-PBGA-B484
S-PBGA-B484
JESD-609 Code
e1
e0
Length
23 mm
27 mm
Moisture Sensitivity Level
3
3
Number of CLBs
24576
Number of Equivalent Gates
1000000
1000000
Number of Terminals
484
484
Operating Temperature-Max
100 °C
70 °C
Operating Temperature-Min
-40 °C
Organization
24576 CLBS, 1000000 GATES
1000000 GATES
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
BGA
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Peak Reflow Temperature (Cel)
250
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
FIELD PROGRAMMABLE GATE ARRAY
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
2.44 mm
2.44 mm
Supply Voltage-Max
1.575 V
1.575 V
Supply Voltage-Min
1.425 V
1.425 V
Supply Voltage-Nom
1.5 V
1.5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
COMMERCIAL
Terminal Finish
TIN SILVER COPPER
TIN LEAD
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
30
Width
23 mm
27 mm
Base Number Matches
3
3
Number of Inputs
300
Number of Logic Cells
24576
Number of Outputs
300
Package Equivalence Code
BGA484,22X22,40
Compare A3P1000-1FGG484I with alternatives
Compare A3P1000-1FG484C with alternatives