A3P060-VQG100I vs A3P060-2FG144YI feature comparison

A3P060-VQG100I Microchip Technology Inc

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A3P060-2FG144YI Microchip Technology Inc

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Rohs Code Yes Yes
Part Life Cycle Code Active Obsolete
Ihs Manufacturer MICROCHIP TECHNOLOGY INC MICROCHIP TECHNOLOGY INC
Package Description 14 X 14 MM, 1 MM HEIGHT, 0.50 MM PITCH, GREEN, VQFP-100 13 X 13 MM, 1.45 MM HEIGHT, 1 MM PITCH, FPBGA-144
Reach Compliance Code compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
Factory Lead Time 8 Weeks
Samacsys Manufacturer Microchip
Clock Frequency-Max 350 MHz
JESD-30 Code S-PQFP-G100 S-PBGA-B144
JESD-609 Code e3 e0
Length 14 mm 13 mm
Moisture Sensitivity Level 3 3
Number of CLBs 1536 1536
Number of Equivalent Gates 60000 60000
Number of Inputs 71 96
Number of Outputs 71 96
Number of Terminals 100 144
Operating Temperature-Max 100 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Organization 1536 CLBS, 60000 GATES 1536 CLBS, 60000 GATES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TFQFP LBGA
Package Shape SQUARE SQUARE
Package Style FLATPACK, THIN PROFILE, FINE PITCH GRID ARRAY, LOW PROFILE
Packing Method TRAY
Peak Reflow Temperature (Cel) 260
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified
Seated Height-Max 1.2 mm 1.55 mm
Supply Voltage-Max 1.575 V 1.575 V
Supply Voltage-Min 1.425 V 1.425 V
Supply Voltage-Nom 1.5 V 1.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish MATTE TIN Tin/Lead (Sn/Pb)
Terminal Form GULL WING BALL
Terminal Pitch 0.5 mm 1 mm
Terminal Position QUAD BOTTOM
Time@Peak Reflow Temperature-Max (s) 30
Width 14 mm 13 mm
Base Number Matches 2 1
Package Equivalence Code BGA144,12X12,40

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