A3P060-2FG144YI vs A3P060-2FG144I feature comparison

A3P060-2FG144YI Microsemi Corporation

Buy Now Datasheet

A3P060-2FG144I Microsemi Corporation

Buy Now Datasheet
Rohs Code Yes No
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer MICROSEMI CORP MICROSEMI CORP
Package Description LBGA, LBGA,
Reach Compliance Code compliant unknown
HTS Code 8542.39.00.01 8542.39.00.01
JESD-30 Code S-PBGA-B144 S-PBGA-B144
JESD-609 Code e0 e0
Length 13 mm 13 mm
Moisture Sensitivity Level 3 3
Number of CLBs 1536 1536
Number of Equivalent Gates 60000 60000
Number of Terminals 144 144
Operating Temperature-Max 85 °C 100 °C
Operating Temperature-Min -40 °C -40 °C
Organization 1536 CLBS, 60000 GATES 1536 CLBS, 60000 GATES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LBGA LBGA
Package Equivalence Code BGA144,12X12,40 BGA144,12X12,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, LOW PROFILE GRID ARRAY, LOW PROFILE
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Seated Height-Max 1.55 mm 1.55 mm
Supply Voltage-Max 1.575 V 1.575 V
Supply Voltage-Min 1.425 V 1.425 V
Supply Voltage-Nom 1.5 V 1.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish TIN LEAD SILVER TIN LEAD SILVER
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Width 13 mm 13 mm
Base Number Matches 3 3
Clock Frequency-Max 350 MHz
Qualification Status Not Qualified

Compare A3P060-2FG144YI with alternatives

Compare A3P060-2FG144I with alternatives