A3P060-FG144IY vs A3P060-FG144YI feature comparison

A3P060-FG144IY Microsemi Corporation

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A3P060-FG144YI Microsemi FPGA & SoC

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Part Life Cycle Code Transferred Transferred
Ihs Manufacturer MICROSEMI CORP MICROSEMI SOC PRODUCTS GROUP
Package Description FPBGA-144 LBGA,
Reach Compliance Code compliant unknown
HTS Code 8542.39.00.01 8542.39.00.01
Date Of Intro 2016-03-25
Additional Feature TERM PITCH-MIN
Clock Frequency-Max 350 MHz
JESD-30 Code S-PBGA-B144 S-PBGA-B144
Length 13 mm 13 mm
Number of Equivalent Gates 60000 60000
Number of Terminals 144 144
Operating Temperature-Max 100 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Organization 60000 GATES 1536 CLBS, 60000 GATES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LBGA LBGA
Package Equivalence Code BGA144,12X12,40 BGA144,12X12,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, LOW PROFILE GRID ARRAY, LOW PROFILE
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Seated Height-Max 1.55 mm 1.55 mm
Supply Voltage-Max 1.575 V 1.575 V
Supply Voltage-Min 1.425 V 1.425 V
Supply Voltage-Nom 1.5 V 1.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Width 13 mm 13 mm
Base Number Matches 1 1
Part Package Code BGA
Pin Count 144
JESD-609 Code e0
Moisture Sensitivity Level 3
Number of CLBs 1536
Terminal Finish TIN LEAD SILVER

Compare A3P060-FG144IY with alternatives

Compare A3P060-FG144YI with alternatives