A3P060-2FGG144YI
vs
A3P060-2FG144
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Active
Ihs Manufacturer
MICROSEMI CORP
MICROCHIP TECHNOLOGY INC
Package Description
LBGA,
13X 13 MM, 1.45 MM HEIGHT, 1 MM PITCH, FBGA-144
Reach Compliance Code
compliant
compliant
HTS Code
8542.39.00.01
8542.39.00.01
JESD-30 Code
S-PBGA-B144
S-PBGA-B144
JESD-609 Code
e1
e0
Length
13 mm
13 mm
Moisture Sensitivity Level
3
3
Number of CLBs
1536
1536
Number of Equivalent Gates
60000
60000
Number of Terminals
144
144
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
Organization
1536 CLBS, 60000 GATES
1536 CLBS, 60000 GATES
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LBGA
LBGA
Package Equivalence Code
BGA144,12X12,40
BGA144,12X12,40
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY, LOW PROFILE
GRID ARRAY, LOW PROFILE
Peak Reflow Temperature (Cel)
260
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
FIELD PROGRAMMABLE GATE ARRAY
Seated Height-Max
1.55 mm
1.55 mm
Supply Voltage-Max
1.575 V
1.575 V
Supply Voltage-Min
1.425 V
1.425 V
Supply Voltage-Nom
1.5 V
1.5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
COMMERCIAL
Terminal Finish
Tin/Silver/Copper (Sn/Ag/Cu)
TIN LEAD SILVER
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
30
Width
13 mm
13 mm
Base Number Matches
3
3
Factory Lead Time
8 Weeks
Clock Frequency-Max
350 MHz
Number of Inputs
96
Number of Outputs
96
Packing Method
TRAY
Qualification Status
Not Qualified
Compare A3P060-2FGG144YI with alternatives
Compare A3P060-2FG144 with alternatives