A3P060-2FG144IY
vs
A3P060-2FG144YI
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
MICROSEMI CORP
MICROCHIP TECHNOLOGY INC
Package Description
FPBGA-144
13 X 13 MM, 1.45 MM HEIGHT, 1 MM PITCH, FPBGA-144
Reach Compliance Code
compliant
compliant
HTS Code
8542.39.00.01
8542.39.00.01
Date Of Intro
2016-03-25
Additional Feature
TERM PITCH-MIN
Clock Frequency-Max
350 MHz
JESD-30 Code
S-PBGA-B144
S-PBGA-B144
Length
13 mm
13 mm
Number of Equivalent Gates
60000
60000
Number of Terminals
144
144
Operating Temperature-Max
100 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Organization
60000 GATES
1536 CLBS, 60000 GATES
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LBGA
LBGA
Package Equivalence Code
BGA144,12X12,40
BGA144,12X12,40
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY, LOW PROFILE
GRID ARRAY, LOW PROFILE
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
FIELD PROGRAMMABLE GATE ARRAY
Seated Height-Max
1.55 mm
1.55 mm
Supply Voltage-Max
1.575 V
1.575 V
Supply Voltage-Min
1.425 V
1.425 V
Supply Voltage-Nom
1.5 V
1.5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Width
13 mm
13 mm
Base Number Matches
2
3
Rohs Code
Yes
JESD-609 Code
e0
Moisture Sensitivity Level
3
Number of CLBs
1536
Number of Inputs
96
Number of Outputs
96
Terminal Finish
Tin/Lead (Sn/Pb)
Compare A3P060-2FG144IY with alternatives
Compare A3P060-2FG144YI with alternatives