A3P060-1VQ100Y vs A3P060-2QN132II feature comparison

A3P060-1VQ100Y Microsemi Corporation

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A3P060-2QN132II Microsemi Corporation

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Rohs Code No
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer MICROSEMI CORP MICROSEMI CORP
Package Description TFQFP, VBCC,
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
JESD-30 Code S-PQFP-G100 S-XBCC-B132
Length 14 mm 8 mm
Number of CLBs 1536 1536
Number of Equivalent Gates 60000 60000
Number of Terminals 100 132
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C
Organization 1536 CLBS, 60000 GATES 1536 CLBS, 60000 GATES
Package Body Material PLASTIC/EPOXY UNSPECIFIED
Package Code TFQFP VBCC
Package Shape SQUARE SQUARE
Package Style FLATPACK, THIN PROFILE, FINE PITCH CHIP CARRIER, VERY THIN PROFILE
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Seated Height-Max 1.2 mm 0.8 mm
Supply Voltage-Max 1.575 V 1.575 V
Supply Voltage-Min 1.425 V 1.425 V
Supply Voltage-Nom 1.5 V 1.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL INDUSTRIAL
Terminal Form GULL WING BUTT
Terminal Pitch 0.5 mm 0.5 mm
Terminal Position QUAD BOTTOM
Width 14 mm 8 mm
Base Number Matches 4 1
Clock Frequency-Max 350 MHz
Qualification Status Not Qualified

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