A2F200M3F-FGH256YI vs A2F200M3F-FGG256 feature comparison

A2F200M3F-FGH256YI Microsemi Corporation

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A2F200M3F-FGG256 Microsemi Corporation

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Rohs Code Yes Yes
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer MICROSEMI CORP MICROSEMI CORP
Package Description LBGA, LBGA, BGA256,16X16,40
Reach Compliance Code compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
JESD-30 Code S-PBGA-B256 S-PBGA-B256
Length 17 mm 17 mm
Number of Equivalent Gates 200000 200000
Number of Inputs 117 117
Number of Logic Cells 4608 4608
Number of Outputs 117 117
Number of Terminals 256 256
Operating Temperature-Max 100 °C 85 °C
Operating Temperature-Min -40 °C
Organization 200000 GATES 200000 GATES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LBGA LBGA
Package Equivalence Code BGA256,16X16,40 BGA256,16X16,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, LOW PROFILE GRID ARRAY, LOW PROFILE
Programmable Logic Type FPGA SOC FPGA SOC
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.7 mm 1.7 mm
Supply Voltage-Max 1.575 V 1.575 V
Supply Voltage-Min 1.425 V 1.425 V
Supply Voltage-Nom 1.5 V 1.5 V
Surface Mount YES YES
Technology CMOS CMOS
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Width 17 mm 17 mm
Base Number Matches 1 6
JESD-609 Code e1
Moisture Sensitivity Level 3
Peak Reflow Temperature (Cel) 250
Temperature Grade OTHER
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
Time@Peak Reflow Temperature-Max (s) 30

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Compare A2F200M3F-FGG256 with alternatives