Findchips: Compare A2F200M3F-FGG256 vs A2F200M3F-FG256YI

A2F200M3F-FGG256 vs A2F200M3F-FG256YI feature comparison

Buy Now Datasheet

Buy Now Datasheet

Rohs Code	Yes	Yes
Part Life Cycle Code	Transferred	Transferred
Ihs Manufacturer	ACTEL CORP	MICROSEMI CORP
Package Description	1 MM PITCH, GREEN, FBGA-256	LBGA, BGA256,16X16,40
Reach Compliance Code	unknown	compliant
Clock Frequency-Max	80 MHz
JESD-30 Code	S-PBGA-B256	S-PBGA-B256
Length	17 mm	17 mm
Number of CLBs	4608
Number of Equivalent Gates	200000	200000
Number of Inputs	66	117
Number of Logic Cells	4608	4608
Number of Outputs	66	117
Number of Terminals	256	256
Operating Temperature-Max	85 °C	100 °C
Operating Temperature-Min		-40 °C
Organization	4608 CLBS, 200000 GATES	200000 GATES
Package Body Material	PLASTIC/EPOXY	PLASTIC/EPOXY
Package Code	LBGA	LBGA
Package Equivalence Code	BGA256,16X16,40	BGA256,16X16,40
Package Shape	SQUARE	SQUARE
Package Style	GRID ARRAY, LOW PROFILE	GRID ARRAY, LOW PROFILE
Programmable Logic Type	FIELD PROGRAMMABLE GATE ARRAY	FPGA SOC
Qualification Status	Not Qualified	Not Qualified
Seated Height-Max	1.7 mm	1.7 mm
Supply Voltage-Max	1.575 V	1.575 V
Supply Voltage-Min	1.425 V	1.425 V
Supply Voltage-Nom	1.5 V	1.5 V
Surface Mount	YES	YES
Technology	CMOS	CMOS
Temperature Grade	OTHER	INDUSTRIAL
Terminal Form	BALL	BALL
Terminal Pitch	1 mm	1 mm
Terminal Position	BOTTOM	BOTTOM
Width	17 mm	17 mm
Base Number Matches	3	3
HTS Code		8542.39.00.01
JESD-609 Code		e0
Moisture Sensitivity Level		3
Terminal Finish		TIN LEAD
	Programmable Logic » Field Programmable Gate Arrays	Programmable Logic » Field Programmable Gate Arrays