A2F200M3F-FG256Y
vs
A2F200M3E-1FG256YC
feature comparison
Rohs Code |
Yes
|
|
Part Life Cycle Code |
Transferred
|
Transferred
|
Ihs Manufacturer |
MICROSEMI CORP
|
MICROSEMI SOC PRODUCTS GROUP
|
Package Description |
LBGA,
|
,
|
Reach Compliance Code |
compliant
|
unknown
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
JESD-30 Code |
S-PBGA-B256
|
|
Length |
17 mm
|
|
Number of Equivalent Gates |
200000
|
|
Number of Inputs |
117
|
|
Number of Logic Cells |
4608
|
|
Number of Outputs |
117
|
|
Number of Terminals |
256
|
|
Operating Temperature-Max |
85 °C
|
|
Operating Temperature-Min |
|
|
Organization |
200000 GATES
|
|
Package Body Material |
PLASTIC/EPOXY
|
|
Package Code |
LBGA
|
|
Package Equivalence Code |
BGA256,16X16,40
|
|
Package Shape |
SQUARE
|
|
Package Style |
GRID ARRAY, LOW PROFILE
|
|
Programmable Logic Type |
FPGA SOC
|
FIELD PROGRAMMABLE GATE ARRAY
|
Seated Height-Max |
1.7 mm
|
|
Supply Voltage-Max |
1.575 V
|
|
Supply Voltage-Min |
1.425 V
|
|
Supply Voltage-Nom |
1.5 V
|
|
Surface Mount |
YES
|
|
Technology |
CMOS
|
|
Temperature Grade |
OTHER
|
|
Terminal Form |
BALL
|
|
Terminal Pitch |
1 mm
|
|
Terminal Position |
BOTTOM
|
|
Width |
17 mm
|
|
Base Number Matches |
3
|
1
|
JESD-609 Code |
|
e0
|
Moisture Sensitivity Level |
|
3
|
Terminal Finish |
|
TIN LEAD
|
|
|
|
Compare A2F200M3F-FG256Y with alternatives
Compare A2F200M3E-1FG256YC with alternatives