A2F200M3E-1FGG256I
vs
A2F200M3F-1FGG256Y
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROCHIP TECHNOLOGY INC
|
| Package Description |
1 MM PITCH, GREEN, FBGA-256
|
17 X 17 MM, 1.60 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-256
|
| Reach Compliance Code |
compliant
|
compliant
|
| HTS Code |
8542.39.00.01
|
8542.31.00.01
|
| JESD-30 Code |
S-PBGA-B256
|
S-PBGA-B256
|
| JESD-609 Code |
e1
|
|
| Length |
17 mm
|
17 mm
|
| Moisture Sensitivity Level |
3
|
|
| Number of Equivalent Gates |
200000
|
200000
|
| Number of Inputs |
117
|
117
|
| Number of Logic Cells |
4608
|
4608
|
| Number of Outputs |
117
|
117
|
| Number of Terminals |
256
|
256
|
| Operating Temperature-Max |
100 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
|
| Organization |
200000 GATES
|
200000 GATES
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
LBGA
|
LFBGA
|
| Package Equivalence Code |
BGA256,16X16,40
|
BGA256,16X16,40
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY, LOW PROFILE
|
GRID ARRAY, LOW PROFILE, FINE PITCH
|
| Peak Reflow Temperature (Cel) |
250
|
|
| Programmable Logic Type |
FPGA SOC
|
FPGA SOC
|
| Qualification Status |
Not Qualified
|
|
| Seated Height-Max |
1.7 mm
|
1.7 mm
|
| Supply Voltage-Max |
1.575 V
|
1.575 V
|
| Supply Voltage-Min |
1.425 V
|
1.425 V
|
| Supply Voltage-Nom |
1.5 V
|
1.5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
|
| Terminal Finish |
TIN SILVER COPPER
|
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
1 mm
|
1 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Width |
17 mm
|
17 mm
|
| Base Number Matches |
3
|
3
|
|
|
|
Compare A2F200M3E-1FGG256I with alternatives
Compare A2F200M3F-1FGG256Y with alternatives