A2F200M3F-1FGG256Y
vs
A2F200M3E-1FGG256YC
feature comparison
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Active
|
Transferred
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROSEMI SOC PRODUCTS GROUP
|
| Package Description |
17 X 17 MM, 1.60 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-256
|
,
|
| Reach Compliance Code |
compliant
|
unknown
|
| HTS Code |
8542.31.00.01
|
8542.39.00.01
|
| JESD-30 Code |
S-PBGA-B256
|
|
| Length |
17 mm
|
|
| Number of Equivalent Gates |
200000
|
|
| Number of Inputs |
117
|
|
| Number of Logic Cells |
4608
|
|
| Number of Outputs |
117
|
|
| Number of Terminals |
256
|
|
| Operating Temperature-Max |
85 °C
|
|
| Operating Temperature-Min |
|
|
| Organization |
200000 GATES
|
|
| Package Body Material |
PLASTIC/EPOXY
|
|
| Package Code |
LFBGA
|
|
| Package Equivalence Code |
BGA256,16X16,40
|
|
| Package Shape |
SQUARE
|
|
| Package Style |
GRID ARRAY, LOW PROFILE, FINE PITCH
|
|
| Programmable Logic Type |
FPGA SOC
|
FIELD PROGRAMMABLE GATE ARRAY
|
| Seated Height-Max |
1.7 mm
|
|
| Supply Voltage-Max |
1.575 V
|
|
| Supply Voltage-Min |
1.425 V
|
|
| Supply Voltage-Nom |
1.5 V
|
|
| Surface Mount |
YES
|
|
| Technology |
CMOS
|
|
| Terminal Form |
BALL
|
|
| Terminal Pitch |
1 mm
|
|
| Terminal Position |
BOTTOM
|
|
| Width |
17 mm
|
|
| Base Number Matches |
3
|
2
|
| JESD-609 Code |
|
e1
|
| Moisture Sensitivity Level |
|
3
|
| Peak Reflow Temperature (Cel) |
|
250
|
| Terminal Finish |
|
Tin/Silver/Copper (Sn/Ag/Cu)
|
| Time@Peak Reflow Temperature-Max (s) |
|
30
|
|
|
|
Compare A2F200M3F-1FGG256Y with alternatives
Compare A2F200M3E-1FGG256YC with alternatives