9FGL699AKLFT
vs
SL28PCIE10ALI
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Transferred
|
Active
|
| Ihs Manufacturer |
INTEGRATED DEVICE TECHNOLOGY INC
|
SILICON LABORATORIES INC
|
| Part Package Code |
VFQFPN
|
QFN
|
| Package Description |
ROHS COMPLIANT, MLF-32
|
QFN-32
|
| Pin Count |
32
|
32
|
| Manufacturer Package Code |
NLG32P1
|
|
| Reach Compliance Code |
compliant
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| JESD-30 Code |
S-XQCC-N32
|
S-XQCC-N32
|
| JESD-609 Code |
e3
|
|
| Length |
5 mm
|
5 mm
|
| Moisture Sensitivity Level |
3
|
|
| Number of Terminals |
32
|
32
|
| Operating Temperature-Max |
70 °C
|
85 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Output Clock Frequency-Max |
100 MHz
|
100 MHz
|
| Package Body Material |
UNSPECIFIED
|
UNSPECIFIED
|
| Package Code |
HVQCCN
|
HVQCCN
|
| Package Equivalence Code |
LCC32,.2SQ,20
|
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
| Peak Reflow Temperature (Cel) |
260
|
NOT SPECIFIED
|
| Primary Clock/Crystal Frequency-Nom |
25 MHz
|
25 MHz
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1 mm
|
0.8 mm
|
| Supply Current-Max |
40 mA
|
|
| Supply Voltage-Max |
3.465 V
|
3.465 V
|
| Supply Voltage-Min |
3.135 V
|
3.135 V
|
| Supply Voltage-Nom |
3.3 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
COMMERCIAL
|
INDUSTRIAL
|
| Terminal Finish |
TIN
|
|
| Terminal Form |
NO LEAD
|
NO LEAD
|
| Terminal Pitch |
0.5 mm
|
0.5 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Width |
5 mm
|
5 mm
|
| uPs/uCs/Peripheral ICs Type |
CLOCK GENERATOR, PROCESSOR SPECIFIC
|
CLOCK GENERATOR, PROCESSOR SPECIFIC
|
| Base Number Matches |
2
|
1
|
| Time@Peak Reflow Temperature-Max (s) |
|
NOT SPECIFIED
|
|
|
|
Compare 9FGL699AKLFT with alternatives
Compare SL28PCIE10ALI with alternatives