98ULPA877AHI-T vs MPC96877EP feature comparison

98ULPA877AHI-T Integrated Device Technology Inc

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MPC96877EP Integrated Device Technology Inc

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Pbfree Code No Yes
Rohs Code No Yes
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer INTEGRATED DEVICE TECHNOLOGY INC INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code BGA QFN
Package Description LFBGA, BGA52,6X10,25 QFN-40
Pin Count 52 40
Reach Compliance Code not_compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
Family 98ULPA 96877
Input Conditioning DIFFERENTIAL DIFFERENTIAL
JESD-30 Code R-PBGA-B52 S-XQCC-N40
JESD-609 Code e0 e3
Length 7 mm
Logic IC Type PLL BASED CLOCK DRIVER PLL BASED CLOCK DRIVER
Max I(ol) 0.009 A
Moisture Sensitivity Level 3
Number of Functions 1 1
Number of Inverted Outputs
Number of Terminals 52 40
Number of True Outputs 10 10
Operating Temperature-Max 85 °C 70 °C
Operating Temperature-Min -40 °C
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY UNSPECIFIED
Package Code LFBGA HQCCN
Package Equivalence Code BGA52,6X10,25
Package Shape RECTANGULAR SQUARE
Package Style GRID ARRAY, LOW PROFILE, FINE PITCH CHIP CARRIER, HEAT SINK/SLUG
Peak Reflow Temperature (Cel) 225 260
Qualification Status Not Qualified Not Qualified
Same Edge Skew-Max (tskwd) 0.04 ns 0.04 ns
Seated Height-Max 1.31 mm
Supply Voltage-Max (Vsup) 1.9 V 1.9 V
Supply Voltage-Min (Vsup) 1.7 V 1.7 V
Supply Voltage-Nom (Vsup) 1.8 V 1.8 V
Surface Mount YES YES
Temperature Grade INDUSTRIAL COMMERCIAL
Terminal Finish TIN LEAD Matte Tin (Sn)
Terminal Form BALL NO LEAD
Terminal Pitch 0.65 mm
Terminal Position BOTTOM QUAD
Time@Peak Reflow Temperature-Max (s) 20 30
Width 4.5 mm
fmax-Min 410 MHz 340 MHz
Base Number Matches 2 1

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