93LC46BT-I/OTGX
vs
93LC46B-TI/OTX
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Active
Active
Ihs Manufacturer
MICROCHIP TECHNOLOGY INC
MICROCHIP TECHNOLOGY INC
Package Description
LSSOP,
LSSOP,
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
HTS Code
8542.32.00.51
Clock Frequency-Max (fCLK)
3 MHz
3 MHz
JESD-30 Code
R-PDSO-G6
R-PDSO-G6
JESD-609 Code
e3
e3
Length
2.95 mm
2.95 mm
Memory Density
1024 bit
1024 bit
Memory IC Type
EEPROM
EEPROM
Memory Width
16
16
Moisture Sensitivity Level
1
1
Number of Functions
1
1
Number of Terminals
6
6
Number of Words
64 words
64 words
Number of Words Code
64
64
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Organization
64X16
64X16
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LSSOP
LSSOP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH
Parallel/Serial
SERIAL
SERIAL
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.45 mm
1.45 mm
Serial Bus Type
MICROWIRE
MICROWIRE
Supply Current-Max
0.002 mA
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
2.5 V
2.5 V
Supply Voltage-Nom (Vsup)
3 V
3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
Matte Tin (Sn)
MATTE TIN
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.95 mm
0.95 mm
Terminal Position
DUAL
DUAL
Width
1.63 mm
1.63 mm
Write Cycle Time-Max (tWC)
6 ms
6 ms
Base Number Matches
1
1
Pbfree Code
Part Package Code
SOT-23
Pin Count
6
Peak Reflow Temperature (Cel)
260
Time@Peak Reflow Temperature-Max (s)
40
Compare 93LC46BT-I/OTGX with alternatives
Compare 93LC46B-TI/OTX with alternatives