93L425DCQP
vs
MCM93425FM
feature comparison
Pbfree Code |
No
|
|
Rohs Code |
No
|
No
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
FAIRCHILD SEMICONDUCTOR CORP
|
MOTOROLA INC
|
Package Description |
DIP, DIP16,.3
|
DIP, FL16,.3
|
Reach Compliance Code |
compliant
|
unknown
|
ECCN Code |
EAR99
|
3A001.A.2.C
|
HTS Code |
8542.32.00.41
|
8542.32.00.41
|
Access Time-Max |
60 ns
|
60 ns
|
JESD-30 Code |
R-XDIP-T16
|
R-GDIP-T16
|
JESD-609 Code |
e0
|
e0
|
Memory Density |
1024 bit
|
1024 bit
|
Memory IC Type |
STANDARD SRAM
|
STANDARD SRAM
|
Memory Width |
1
|
1
|
Moisture Sensitivity Level |
2A
|
|
Number of Terminals |
16
|
16
|
Number of Words |
1024 words
|
1024 words
|
Number of Words Code |
1000
|
1000
|
Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
Operating Temperature-Max |
70 °C
|
125 °C
|
Operating Temperature-Min |
|
-55 °C
|
Organization |
1KX1
|
1KX1
|
Output Characteristics |
3-STATE
|
3-STATE
|
Package Body Material |
CERAMIC
|
CERAMIC, GLASS-SEALED
|
Package Code |
DIP
|
DIP
|
Package Equivalence Code |
DIP16,.3
|
FL16,.3
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
IN-LINE
|
IN-LINE
|
Parallel/Serial |
PARALLEL
|
PARALLEL
|
Supply Current-Max |
0.065 mA
|
0.17 mA
|
Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
Surface Mount |
NO
|
NO
|
Technology |
TTL
|
CMOS
|
Temperature Grade |
COMMERCIAL
|
MILITARY
|
Terminal Finish |
TIN LEAD
|
TIN LEAD
|
Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
Terminal Pitch |
2.54 mm
|
2.54 mm
|
Terminal Position |
DUAL
|
DUAL
|
Base Number Matches |
1
|
3
|
Part Package Code |
|
DIP
|
Pin Count |
|
16
|
Length |
|
19.495 mm
|
Number of Functions |
|
1
|
Qualification Status |
|
Not Qualified
|
Seated Height-Max |
|
5.08 mm
|
Supply Voltage-Max (Vsup) |
|
5.5 V
|
Supply Voltage-Min (Vsup) |
|
4.5 V
|
Width |
|
7.62 mm
|
|
|
|
Compare 93L425DCQP with alternatives
Compare MCM93425FM with alternatives