MCM93425FM vs AM93L425PC feature comparison

MCM93425FM Freescale Semiconductor

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AM93L425PC Rochester Electronics LLC

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Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer MOTOROLA SEMICONDUCTOR PRODUCTS ROCHESTER ELECTRONICS LLC
Package Description DFP, FL16,.3 DIP,
Reach Compliance Code unknown unknown
Access Time-Max 60 ns 60 ns
JESD-30 Code R-XDFP-F16 R-PDIP-T16
JESD-609 Code e0
Memory Density 1024 bit 1024 bit
Memory IC Type STANDARD SRAM STANDARD SRAM
Memory Width 1 1
Number of Terminals 16 16
Number of Words 1024 words 1024 words
Number of Words Code 1000 1000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 125 °C 75 °C
Operating Temperature-Min -55 °C
Organization 1KX1 1KX1
Output Characteristics 3-STATE
Package Body Material CERAMIC PLASTIC/EPOXY
Package Code DFP DIP
Package Equivalence Code FL16,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style FLATPACK IN-LINE
Parallel/Serial PARALLEL PARALLEL
Power Supplies 5 V
Qualification Status Not Qualified Not Qualified
Supply Current-Max 0.17 mA
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES NO
Technology TTL TTL
Temperature Grade MILITARY COMMERCIAL EXTENDED
Terminal Finish Tin/Lead (Sn/Pb)
Terminal Form FLAT THROUGH-HOLE
Terminal Pitch 1.27 mm 2.54 mm
Terminal Position DUAL DUAL
Base Number Matches 3 2
Pbfree Code No
Part Package Code DIP
Pin Count 16
ECCN Code EAR99
HTS Code 8542.32.00.41
Length 19.05 mm
Number of Functions 1
Peak Reflow Temperature (Cel) NOT SPECIFIED
Seated Height-Max 5.08 mm
Supply Voltage-Max (Vsup) 5.25 V
Supply Voltage-Min (Vsup) 4.75 V
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 7.62 mm

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