93AA56BX-I/SNG
vs
93AA56BXT-E/MC
feature comparison
All Stats
Differences Only
Pbfree Code
Yes
Yes
Rohs Code
Yes
Yes
Part Life Cycle Code
Active
Active
Ihs Manufacturer
MICROCHIP TECHNOLOGY INC
MICROCHIP TECHNOLOGY INC
Part Package Code
SOIC
DFN
Package Description
3.90 MM, ROHS COMPLIANT, PLASTIC, SOIC-8
2 X 3 MM, 0.90 MM HEIGHT, ROHS COMPLIANT, PLASTIC, DFN-8
Pin Count
8
8
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.51
8542.32.00.51
Alternate Memory Width
8
8
Clock Frequency-Max (fCLK)
1 MHz
3 MHz
Data Retention Time-Min
200
Endurance
1000000 Write/Erase Cycles
JESD-30 Code
R-PDSO-G8
R-PDSO-N8
JESD-609 Code
e3
e3
Length
4.9 mm
3 mm
Memory Density
2048 bit
2048 bit
Memory IC Type
EEPROM
EEPROM
Memory Width
16
8
Moisture Sensitivity Level
1
1
Number of Functions
1
1
Number of Terminals
8
8
Number of Words
128 words
256 words
Number of Words Code
128
256
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Organization
128X16
256X8
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
SOP
VSON
Package Equivalence Code
SOP8,.25
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
SMALL OUTLINE, VERY THIN PROFILE
Parallel/Serial
SERIAL
SERIAL
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.75 mm
1 mm
Serial Bus Type
MICROWIRE
MICROWIRE
Standby Current-Max
0.000001 A
Supply Current-Max
0.002 mA
0.002 mA
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
1.8 V
1.8 V
Supply Voltage-Nom (Vsup)
2.5 V
2.5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
Matte Tin (Sn)
Matte Tin (Sn)
Terminal Form
GULL WING
NO LEAD
Terminal Pitch
1.27 mm
0.5 mm
Terminal Position
DUAL
DUAL
Width
3.9 mm
2 mm
Write Cycle Time-Max (tWC)
6 ms
6 ms
Write Protection
SOFTWARE
Base Number Matches
1
1
Compare 93AA56BX-I/SNG with alternatives
Compare 93AA56BXT-E/MC with alternatives