935300348118
vs
74HC597PW,118
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
NXP SEMICONDUCTORS
NXP SEMICONDUCTORS
Package Description
TSSOP,
Reach Compliance Code
unknown
compliant
HTS Code
8542.39.00.01
8542.39.00.01
Count Direction
RIGHT
RIGHT
Family
HC/UH
HC/UH
JESD-30 Code
R-PDSO-G16
R-PDSO-G16
Length
5 mm
5 mm
Logic IC Type
PARALLEL IN SERIAL OUT
PARALLEL IN SERIAL OUT
Number of Bits
8
8
Number of Functions
1
1
Number of Terminals
16
16
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-40 °C
-40 °C
Output Polarity
TRUE
TRUE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TSSOP
TSSOP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Propagation Delay (tpd)
265 ns
53 ns
Screening Level
AEC-Q100
Seated Height-Max
1.1 mm
1.1 mm
Supply Voltage-Max (Vsup)
6 V
6 V
Supply Voltage-Min (Vsup)
2 V
2 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
AUTOMOTIVE
AUTOMOTIVE
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.65 mm
0.65 mm
Terminal Position
DUAL
DUAL
Trigger Type
POSITIVE EDGE
POSITIVE EDGE
Width
4.4 mm
4.4 mm
fmax-Min
24 MHz
20 MHz
Base Number Matches
2
2
Rohs Code
Part Package Code
TSSOP
Pin Count
16
Manufacturer Package Code
SOT403-1
Factory Lead Time
4 Weeks
JESD-609 Code
e4
Load Capacitance (CL)
50 pF
Max Frequency@Nom-Sup
20000000 Hz
Moisture Sensitivity Level
1
Package Equivalence Code
TSSOP16,.25
Peak Reflow Temperature (Cel)
260
Qualification Status
Not Qualified
Terminal Finish
Nickel/Palladium/Gold (Ni/Pd/Au)
Time@Peak Reflow Temperature-Max (s)
30
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