935293623125
vs
TLE6253GV33
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
NXP SEMICONDUCTORS
INFINEON TECHNOLOGIES AG
Package Description
TSSOP,
SOP,
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
8542.39.00.01
JESD-30 Code
R-PDSO-G6
R-PDSO-G16
Length
2.9 mm
10 mm
Number of Functions
1
1
Number of Terminals
6
16
Operating Temperature-Max
125 °C
Operating Temperature-Min
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TSSOP
SOP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
SMALL OUTLINE
Seated Height-Max
1.1 mm
1.75 mm
Supply Voltage-Nom
3.3 V
3.3 V
Surface Mount
YES
YES
Telecom IC Type
INTERFACE CIRCUIT
INTERFACE CIRCUIT
Temperature Grade
AUTOMOTIVE
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.95 mm
1.27 mm
Terminal Position
DUAL
DUAL
Width
1.5 mm
4 mm
Base Number Matches
1
1
Part Package Code
SOIC
Pin Count
16
Qualification Status
Not Qualified
Compare 935293623125 with alternatives
Compare TLE6253GV33 with alternatives