935293623125
vs
NCN5121MNTWG
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Active
Ihs Manufacturer
NXP SEMICONDUCTORS
ONSEMI
Package Description
TSSOP,
QFN-40
Reach Compliance Code
unknown
compliant
HTS Code
8542.39.00.01
8542.39.00.01
JESD-30 Code
R-PDSO-G6
S-XQCC-N40
Length
2.9 mm
6 mm
Number of Functions
1
1
Number of Terminals
6
40
Operating Temperature-Max
125 °C
105 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
PLASTIC/EPOXY
UNSPECIFIED
Package Code
TSSOP
HVQCCN
Package Shape
RECTANGULAR
SQUARE
Package Style
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
Seated Height-Max
1.1 mm
1 mm
Supply Voltage-Nom
3.3 V
3.3 V
Surface Mount
YES
YES
Telecom IC Type
INTERFACE CIRCUIT
INTERFACE CIRCUIT
Temperature Grade
AUTOMOTIVE
INDUSTRIAL
Terminal Form
GULL WING
NO LEAD
Terminal Pitch
0.95 mm
0.5 mm
Terminal Position
DUAL
QUAD
Width
1.5 mm
6 mm
Base Number Matches
1
1
Pbfree Code
Part Package Code
QFN-40
Manufacturer Package Code
485AU
Factory Lead Time
72 Weeks
Samacsys Manufacturer
onsemi
JESD-609 Code
e3
Moisture Sensitivity Level
3
Peak Reflow Temperature (Cel)
260
Terminal Finish
MATTE TIN
Time@Peak Reflow Temperature-Max (s)
30
Compare 935293623125 with alternatives
Compare NCN5121MNTWG with alternatives