935291162118 vs LSF0102YZT feature comparison

935291162118 NXP Semiconductors

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LSF0102YZT Texas Instruments

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Part Life Cycle Code Active Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS TEXAS INSTRUMENTS INC
Package Description , VFBGA,
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature Also Required Vref(B) Supply 0 to 5.5V
Interface IC Type INTERFACE CIRCUIT INTERFACE CIRCUIT
JESD-30 Code S-PDSO-G8 R-PBGA-B8
Length 3 mm 1.888 mm
Moisture Sensitivity Level 1
Number of Functions 1 1
Number of Terminals 8 8
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSSOP VFBGA
Package Equivalence Code TSSOP8,.19 BGA8,2X4,20
Package Shape SQUARE RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Cel) 260
Seated Height-Max 1.1 mm 0.625 mm
Supply Voltage-Max 5.4 V 4.5 V
Supply Voltage-Min 1 V
Supply Voltage1-Max 5.5 V 5.5 V
Supply Voltage1-Min 1.8 V
Surface Mount YES YES
Temperature Grade INDUSTRIAL AUTOMOTIVE
Terminal Form GULL WING BALL
Terminal Pitch 0.65 mm 0.5 mm
Terminal Position DUAL BOTTOM
Time@Peak Reflow Temperature-Max (s) 30
Width 3 mm 0.888 mm
Base Number Matches 1 2
Supply Voltage-Nom 3.3 V
Supply Voltage1-Nom 3.3 V

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