935291162118
vs
LSF0102YZT
feature comparison
Part Life Cycle Code |
Active
|
Obsolete
|
Ihs Manufacturer |
NXP SEMICONDUCTORS
|
TEXAS INSTRUMENTS INC
|
Package Description |
,
|
VFBGA,
|
Reach Compliance Code |
unknown
|
unknown
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Additional Feature |
Also Required Vref(B) Supply 0 to 5.5V
|
|
Interface IC Type |
INTERFACE CIRCUIT
|
INTERFACE CIRCUIT
|
JESD-30 Code |
S-PDSO-G8
|
R-PBGA-B8
|
Length |
3 mm
|
1.888 mm
|
Moisture Sensitivity Level |
1
|
|
Number of Functions |
1
|
1
|
Number of Terminals |
8
|
8
|
Operating Temperature-Max |
85 °C
|
125 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
TSSOP
|
VFBGA
|
Package Equivalence Code |
TSSOP8,.19
|
BGA8,2X4,20
|
Package Shape |
SQUARE
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
Peak Reflow Temperature (Cel) |
260
|
|
Seated Height-Max |
1.1 mm
|
0.625 mm
|
Supply Voltage-Max |
5.4 V
|
4.5 V
|
Supply Voltage-Min |
|
1 V
|
Supply Voltage1-Max |
5.5 V
|
5.5 V
|
Supply Voltage1-Min |
|
1.8 V
|
Surface Mount |
YES
|
YES
|
Temperature Grade |
INDUSTRIAL
|
AUTOMOTIVE
|
Terminal Form |
GULL WING
|
BALL
|
Terminal Pitch |
0.65 mm
|
0.5 mm
|
Terminal Position |
DUAL
|
BOTTOM
|
Time@Peak Reflow Temperature-Max (s) |
30
|
|
Width |
3 mm
|
0.888 mm
|
Base Number Matches |
1
|
2
|
Supply Voltage-Nom |
|
3.3 V
|
Supply Voltage1-Nom |
|
3.3 V
|
|
|
|
Compare 935291162118 with alternatives
Compare LSF0102YZT with alternatives