935290454112
vs
PI2C5001AJ
feature comparison
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
NXP SEMICONDUCTORS
|
PERICOM SEMICONDUCTOR CORP
|
| Package Description |
SOP,
|
0.680 X 0.680, PLASTIC, LCC-44
|
| Reach Compliance Code |
compliant
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| JESD-30 Code |
R-PDSO-G8
|
S-PQCC-J44
|
| JESD-609 Code |
e4
|
e0
|
| Length |
4.9 mm
|
16.475 mm
|
| Moisture Sensitivity Level |
1
|
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
8
|
44
|
| Operating Temperature-Max |
105 °C
|
70 °C
|
| Operating Temperature-Min |
-40 °C
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
SOP
|
QCCJ
|
| Package Shape |
RECTANGULAR
|
SQUARE
|
| Package Style |
SMALL OUTLINE
|
CHIP CARRIER
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Seated Height-Max |
1.75 mm
|
4.4 mm
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Telecom IC Type |
SUPPORT CIRCUIT
|
SUPPORT CIRCUIT
|
| Temperature Grade |
INDUSTRIAL
|
COMMERCIAL
|
| Terminal Finish |
Nickel/Palladium/Gold (Ni/Pd/Au)
|
TIN LEAD
|
| Terminal Form |
GULL WING
|
J BEND
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
QUAD
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Width |
3.9 mm
|
16.475 mm
|
| Base Number Matches |
1
|
1
|
| Part Package Code |
|
LCC
|
| Pin Count |
|
44
|
| ECCN Code |
|
EAR99
|
| Qualification Status |
|
Not Qualified
|
|
|
|
Compare 935290454112 with alternatives
Compare PI2C5001AJ with alternatives